Thomas Vogelsang: Professional

Publications (26)

International Symposium on Memory Systems	September 2021	DRAM Refresh with Master Wordline Granularity Control of Refresh Intervals
13th Workshop on Low Temperature Electronics	September 2018	Some Like It Cold: Initial Testing Results for Cryogenic Computing Component
International Memory Workshop	May 2018	DRAM Retention at Cryogenic Temperatures
Journal of Electronic Imaging	April 2018	Optimization of CMOS image sensor utilizing variable temporal multisampling partial transfer technique to achieve full-frame high dynamic range with superior low light and stop motion capability
Electronic Imaging	February 2017	Optimization of CMOS image sensor utilizing variable temporal multi-sampling partial transfer technique to achieve full-frame high dynamic range with superior low light and stop motion capability
International Symposium on Circuits and Systems	May 2017	Reducing electrical power dissipation in computational imaging systems through special-purpose optics
COSI	July 2016	Optical Performance of Computational Diffractive Imagers
VLSI Symposium	June 2016	Lensless Smart Sensors: Optical and Thermal Sensing for the IoT
Sensors Magazine	April 2016	Reduction of CMOS Image Sensor Read Noise to Enable Photon Counting
IISW	June 2015	A 2MP Oversampling Image Sensor with 2.75μs Row Time and Conditional Threshold Comparison
COSI	June 2015	Computational Diffractive Imager with Low-Power Image Change Detection
ISCE	June 2014	Non-Destructive Threshold Assessment of a Pinned Photo Diode Pixel with Correlated Double Sampling
JEI	January 2014	Hardware Validated Unified Model of Multibit Temporally and Spatially Oversampled Image Sensors with Conditional Reset
ICIP	August 2013	Multichannel Sampling of Low Light Level Scenes with Unknown Shifts
IISW	June 2013	Overcoming the Full Well Capacity Limit: High Dynamic Range Imaging Using Multi-Bit Temporal Oversampling and Conditional Reset
IEEE Sensors Conference	October 2012	High-Dynamic-Range Binary Pixel Processing Using Non-Destructive Reads and Variable Oversampling and Thresholds
Micro	December 2010	Understanding the Energy Consumption of Dynamic Random Access Memories
JSSCC	January 2005	A 3.6-Gb/s Point-to-Point Heterogeneous-Voltage-Capable DRAM Interface for Capacity-Scalable Memory Subsystems
ISSCC	February 2004	A 2Gb/s Point-to-Point Heterogeneous Voltage Capable DRAM Interface for Capacity-Scalable Memory Subsystems
VLSI Symposium	June 2002	A 110nm 512Mb DDR DRAM with Vertical Transistor Trench Cell
SSDM	September 1994	Modelling and Fabrication of a P-Channel SiGe-MOSFET with Very High Mobility and Transconductance
TED	September 1994	A Comparison of Numerical Solutions of the Boltzmann Transport Equation for High-Energy Electron Transport Silicon
APL	July 1993	Electron Transport in Strained Si Layers on Si1-xGx substrates
TED	November 1992	Electron Mobilities and High-Field Drift Velocities in Strained Silicon on Silicon-Germanium Substrates
JAP	August 1991	A Novel Approach for Including Band-Structure Effects in a Monte Carlo Simulation of Electron Transport in Silicon
ESSDERC	September 1989	Charge transport near the Si/SiO2 Interface in MOSFET Devices

Patents (126)

US 11,972,121 B2	Load-Reduced DRAM Stack
US 11,934,654 B2	Memory Device Having Hidden Refresh
US 11,922,066 B2	Stacked Device Communication
US 11,868,619 B2	Partial Array Refresh Timing
US 11,842,762 B2	System Application of DRAM Component with Cache Mode
US 11,842,761 B2	Memory System with Multiple Open Rows per Bank
US 11,823,734 B2	DRAM Device with Multiple Voltage Domains
US 11,822,822 B2	Memory Component Having Internal Read-Modify-Write Operation
US 11,804,250 B2	Memory with Deferred Fractional Row Activation
US 11,775,213 B2	Stacked Memory Device with Paired Channels
US 11,646,090 B2	DRAM Retention Test Method for Dynamic Error Correction
US 11,645,212 B2	Dynamic Processing Speed
US 11,600,349 B2	Testing Through-Silicon-Vias
US 11,347,441 B2	Memory Component Having Internal Read-Modify-Write Operation
US 11,341,086 B2	Compute Accelerator with 3D Data Flows
US 11,284,034 B2	Fractional-Readout Oversampled Image Sensor
US 11,270,741 B2	Deferred Fractional Memory Row Activation
US 11,257,539 B2	Reduced Transport Energy in a Memory System
US 11,227,639 B2	Stacked DRAM Device and Method of Manufacture
US 11,114,150 B2	Memory System with Multiple Open Rows per Bank
US 11,109,512 B2	Memory Subsystem for a Cryogenic Digital System
US 11,069,392 B2	Memory Component with Efficient Write Operations
US 11,032,495 B1	Shared-Counter Image Sensor
US 11,029,216 B1	IC With Strategically Biased Digital Circuitry
US 11,012,649 B2	Feedthrough-Compensated Image Sensor
US 11,011,248 B2	DRAM Retention Test Method for Dynamic Error Correction
US 11,004,530 B2	Testing Through-Silicon-Vias
US 10,885,946 B2	Stacked DRAM Device and Method of Manufacture
US 10,860,253 B2	Memory Component Having Internal Read-Modify-Write Operation
US 10,839,884 B2	Memory Component with Efficient Write Operations
US 10,811,062 B2	Deferred Fractional Memory Row Activation
US 10,798,322 B2	High Dynamic-Range Image Sensor
US 10,706,913 B2	Reduced Transport Energy in a Memory System
US 10,659,715 B2	Fractional-Readout Oversampled Image Sensor
US 10,652,493 B2	Low-Noise High Dynamic-Range Image Sensor
US 10,652,435 B2	Methods and Systems for Reducing Image Artifacts
US 10,614,859 B2	Stacked DRAM Device and Method of Manufacture
US 10,594,973 B2	Conditional-reset, Multi-bit Read-out Image Sensor
US 10,497,457 B2	DRAM Retention Test Method for Dynamic Error Correction
US 10,388,337 B2	Memory with Deferred Fractional Row Activation
US 10,378,967 B1	Dual Temperature Band Integrated Circuit Device
US 10,362,256 B2	Fractional-Readout Oversampled Image Sensor
US 10,356,350 B2	Dark-Emulation Image Sensor
US 10,277,843 B2	Oversampled Image Sensor with Conditional Pixel Readout
US 10,274,652 B2	Systems and Methods for Improving Resolution in Lensless Imaging
US 10,269,411 B2	Memory Controller and Memory Device Command Protocol
US 10,264,195 B1	Shared-Counter Image Sensor
US 10,262,750 B2	Testing Through-Silicon Vias
US 10,261,584 B2	Touchless Interface for Handheld and Wearable Computers
US 10,249,660 B2	Split-Gate Conditional-Reset Image Sensor
US 10,248,358 B2	Memory Component Having Internal Read-Modify-Write Operation
US 10,204,662 B2	Stacked DRAM Device and Method of Manufacture
US 10,199,089 B2	Reduced Transport Energy in a Memory System
US 10,165,209 B2	Low-Noise High Dynamic-Range Image Sensor
US 10,154,220 B2	Imaging System with Dynamic Reconstruction Workload Allocation
US 10,136,090 B2	Threshold Monitoring, Conditional-Reset Image Sensor
US 10,104,318 B2	High Dynamic-Range Image Sensor
US 10,070,084 B2	Image Sensor with Multi-Range Readout
US 9,983,830 B2	Memory Component Having Internal Read Modify-Write Operation
US 9,911,468 B2	Memory with Deferred Fractional Row Activation
US 9,894,304 B1	Line Interleaved Image Sensors
US 9,875,787 B2	Reduced Transport Energy in a Memory System
US 9,826,176 B1	Shared Counter Image Sensor
US 9,691,504 B2	DRAM Retention Test Method for Dynamic Error Correction
US 9,681,071 B2	Image Sensor with Exception Coded Output Compression
US 9,667,898 B2	Conditional Reset, Multi-Bit Read-Out Image Sensor
US 9,666,238 B2	Stacked DRAM Device and Method of Manufacture
US 9,575,835 B2	Error Correction in a Memory Device
US 9,570,196 B2	Testing Through-Silicon-Vias
US 9,570,144 B2	Memory Refresh Method and Devices
US 9,570,126 B2	Memory with Deferred Fractional Row Activation
US 9,548,102 B2	Multi-die DRAM Banks Arrangement and Wiring
US 9,521,351 B1	Fractional Readout Oversampled Image Sensor
US 9,521,349 B2	Image Sensor Architecture with Power Saving Readout
US 9,521,338 B2	Image Sensor Sampled at Non-Uniform Intervals
US 9,515,008 B2	Techniques for Interconnecting Stacked Dies Using Connection Sites
US 9,491,391 B2	Image Sensor with Threshold-Based Output Encoding
US 9,438,826 B2	Pixel Structure and Reset Scheme
US 9,437,280 B2	DRAM Sense-Amplifier that Supports Low Memory-Cell Capacitance
US 9,432,597 B2	Low-Noise High Dynamic-Range Image Sensor
US 9,411,678 B1	DRAM Retention Monitoring Method for Dynamic Error Correction
US 9,380,245 B1	Conditional-Reset Image Sensor with Analog Counter Array
US 9,361,960 B2	Configurable Memory Banks of a Memory Device
US 9,344,635 B2	Conditionally-Reset, Temporally Oversampled Image Sensor
US 9,330,735 B2	Memory with deferred fractional row activation
US 9,287,239 B2	Techniques for Interconnecting Stacked Dies Using Connection Sites
US 9,286,965 B2	Memory Refresh Method and Devices
US 9,264,639 B2	Feedthrough-Compensated Image Sensor
US 9,256,376 B2	Methods and Circuits for Dynamically Scaling DRAM Power and Performance
US 9,214,219 B2	Distributed Sub-Page Selection
US 9,116,781 B2	Memory Controller and Memory Device Command Protocol
US 9,111,588 B2	Multi-Die DRAM Banks Arrangement and Wiring
US 9,037,949 B1	Error Correction in a Memory Device
US 9,036,065 B1	Shared-Counter Image Sensor
US 9,001,606 B2	Memory Methods and Systems with Adiabatic Switching
US 9,001,251 B2	Oversampled Image Sensor with Conditional Pixel Read-Out
US 8,982,598 B2	Stacked Memory Device with Redundant Resources to Correct Defects
US 8,930,779 B2	Bit-Replacement Technique for DRAM Error Correction
US 8,908,454 B2	Memory Architecture with Redundant Resources
US 8,885,423 B2	DRAM Sense-Amplifier that Supports Low Memory-Cell Capacitance
US 8,811,095 B2	Methods and Circuits for Dynamically Scaling DRAM Power and Performance
US 8,717,797 B2	Semiconductor Memory Device with Hierarchical Bitlines
US 8,473,808 B2	Semiconductor Memory Having Non-Standard Form Factor
US 7,956,644 B2	Peak Power Reduction using Fixed Bit Inversion
US 7,937,631 B2	Method for Self-Test and Self-Repair in a Multi-Chip Package Environment
US 7,797,511 B2	Memory Refresh System and Method
US 7,440,347 B1	Circuit and Method to Find Wordline-Bitline Shorts in a DRAM
US 7,375,999 B2	Low Equalized Sense-Amp for Twin Cell DRAMs
US 7,342,291 B2	Standby Current Reduction over a Process Window with a Trimmable Well Bias
US 7,333,383 B2	Fuse Resistance Readout Circuit
US 7,293,190 B2	Noisy Clock Test Method and Apparatus
US 7,254,089 B2	Memory with Selectable Single Cell or Twin Cell Configuration
US 7,227,799 B2	Sense Amplifier for Eliminating Leakage Current due to Bit Line Shorts
US 7,060,566 B2	Standby Current Reduction over a Process Window with a Trimmable Well Bias
US 7,060,529 B2	Multiple Chip Semiconductor Arrangement Having Electrical Components in Separating Regions
US 6,815,803 B1	Multiple Chip Semiconductor Arrangement Having Electrical Components in Separating Regions
US 6,813,193 B2	Memory Device and Method of Outputting Data from a Memory Device
US 6,730,989 B1	Semiconductor Package and Method
US 6,369,606 B1	Mixed Threshold Voltage CMOS Logic Device and Method for Manufacture Thereof
US 6,160,747	Configuration for Crosstalk Attenuation in Word Lines of DRAM Circuits
US 6,067,261	Timing of Wordline Activation for DC Burn-In of a DRAM with the Self-Refresh
US 6,049,492	Integrated Sense-Amplifier with a Single-Sided Precharge Device
US 5,612,233	Method for Manufacturing a Single Electron Component
US 5,559,353	Integrated Circuit Structure Having at Least One CMOS NAND Gate and Method for the Manufacture Thereof
US 5,540,977	Microelectronic Component
US 5,443,992	Method for Manufacturing an Integrated Circuit Having at Least One MOS Transistor.